Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles
Author:
Funder
Beijing Municipal Commission of Education
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-12492-w.pdf
Reference36 articles.
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2. C. Hang, J. Liu, J. Wang et al., A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu. J. Mater. Sci.: Mater. Electron. 31, 14157–14164 (2020). https://doi.org/10.1007/s10854-020-03970-y
3. M. Zhang, L. Gao, J. Li, R. Sun, Z. Liu, Characterization of Cu–Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper. Mater. Chem. Phys. 306, 128089 (2023). https://doi.org/10.1016/j.matchemphys.2023.128089
4. Y. Yuan, H. Wu, J. Li, P. Zhu, R. Sun, Cu–Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition. Appl. Surf. Sci. 570, 151220 (2021). https://doi.org/10.1016/j.apsusc.2021.151220
5. T. Chen, K. Siow, Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints. J. Alloys Compd. 866, 158783 (2021). https://doi.org/10.1016/j.jallcom.2021.158783
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