Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy
Author:
Funder
Ministry of Higher Education, Malaysia
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-13164-5.pdf
Reference38 articles.
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2. Y.-A. Shen, Effect of indium addition on mechanical, thermal, and soldering properties of eutectic Sn–9Zn alloy. Mater. Chem. Phys. 315, 128992 (2024)
3. A.D. Laksono, Y.A. Shen, T. Chen, Y.W. Yen, Dissolution behavior of Cu-2.0 wt.% Be (alloy 25) and Cu-0.1 wt.% Fe (C19210) substrates in molten Sn-9 wt.% Zn solder. JOM 1–9 (2024). https://doi.org/10.1007/s11837-024-06426-4
4. K. Nogita, J. Read, T. Nishimura, K. Sweatman, S. Suenaga, A.K. Dahle, Microstructure control in Sn–0.7 mass% Cu alloys. Mater. Trans. 46(11), 2419–2425 (2005)
5. Z. Li, S. Belyakov, J. Xian, C. Gourlay, The influence of primary Cu6Sn5 size on the shear impact properties of Sn-Cu/Cu BGA joints. J. Electron. Mater. 47(1), 84–95 (2018)
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